The Effect of Ultrasonic Agitation on the Seedless Growth of Copper on Ruthenium–Tungsten Thin Films †
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Santos, R.F.; Oliveira, B.M.C.; Ferreira, P.J.; Vieira, M.F. The Effect of Ultrasonic Agitation on the Seedless Growth of Copper on Ruthenium–Tungsten Thin Films. Mater. Proc. 2022, 8, 110. https://doi.org/10.3390/materproc2022008110
Santos RF, Oliveira BMC, Ferreira PJ, Vieira MF. The Effect of Ultrasonic Agitation on the Seedless Growth of Copper on Ruthenium–Tungsten Thin Films. Materials Proceedings. 2022; 8(1):110. https://doi.org/10.3390/materproc2022008110
Chicago/Turabian StyleSantos, Rúben F., Bruno M. C. Oliveira, Paulo J. Ferreira, and Manuel F. Vieira. 2022. "The Effect of Ultrasonic Agitation on the Seedless Growth of Copper on Ruthenium–Tungsten Thin Films" Materials Proceedings 8, no. 1: 110. https://doi.org/10.3390/materproc2022008110
APA StyleSantos, R. F., Oliveira, B. M. C., Ferreira, P. J., & Vieira, M. F. (2022). The Effect of Ultrasonic Agitation on the Seedless Growth of Copper on Ruthenium–Tungsten Thin Films. Materials Proceedings, 8(1), 110. https://doi.org/10.3390/materproc2022008110