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Engineering Proceedings
Volume 89
Issue 1
10.3390/engproc2025089047
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Editorial

Statement of Peer Review †

by
Teen-Hang Meen
1,*,
Chun-Yen Chang
2 and
Cheng-Fu Yang
3,4,*
1
Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
2
Graduate Institute of Science Education, National Taiwan Normal University, Taipei 116, Taiwan
3
Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan
4
Department of Aeronautical Engineering, Chaoyang University of Technology, Taichung 413, Taiwan
*
Authors to whom correspondence should be addressed.
†
All proceeding papers published in this volume were presented at the 2024 IEEE 7th International Conference on Knowledge Innovation and Invention, Nagoya, Japan, 16–18 August 2024.
Eng. Proc. 2025, 89(1), 47; https://doi.org/10.3390/engproc2025089047
Published: 8 May 2025
(This article belongs to the Proceedings of 2024 IEEE 7th International Conference on Knowledge Innovation and Invention)
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Versions Notes
In submitting conference proceedings of the 2024 IEEE 7th International Conference on Knowledge Innovation and Invention (IEEE ICKII 2024) to Engineering Proceedings, the volume editors of the proceedings certify to the publisher that all papers published in this volume have been subjected to peer review administered by the volume editors. Reviews were conducted by expert referees to the professional and scientific standards expected of a proceedings journal.
  • Type of peer review: 2–3 reviewers by double-blind;
  • Conference submission management system: online submission system on conference homepage;
  • Number of submissions sent for review: 223;
  • Number of submissions accepted: 55;
  • Number of submissions published: 46;
  • Acceptance rate: 0.247;
  • Total number of reviewers involved: 50;
  • Any additional information on the review process: Please refer to Figure 1.
Engproc 89 00047 g001
Figure 1. Review process for conference proceedings of 2024 IEEE 7th International Conference on Knowledge Innovation and Invention (IEEE ICKII 2024).
Figure 1. Review process for conference proceedings of 2024 IEEE 7th International Conference on Knowledge Innovation and Invention (IEEE ICKII 2024).
Engproc 89 00047 g001

Conflicts of Interest

The authors declare no conflict of interest.
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content.

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MDPI and ACS Style

Meen, T.-H.; Chang, C.-Y.; Yang, C.-F. Statement of Peer Review. Eng. Proc. 2025, 89, 47. https://doi.org/10.3390/engproc2025089047

AMA Style

Meen T-H, Chang C-Y, Yang C-F. Statement of Peer Review. Engineering Proceedings. 2025; 89(1):47. https://doi.org/10.3390/engproc2025089047

Chicago/Turabian Style

Meen, Teen-Hang, Chun-Yen Chang, and Cheng-Fu Yang. 2025. "Statement of Peer Review" Engineering Proceedings 89, no. 1: 47. https://doi.org/10.3390/engproc2025089047

APA Style

Meen, T.-H., Chang, C.-Y., & Yang, C.-F. (2025). Statement of Peer Review. Engineering Proceedings, 89(1), 47. https://doi.org/10.3390/engproc2025089047

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