Preface of the International Conference on Electronics, Engineering Physics and Earth Science (EEPES’23) †
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Department of Telecommunication, University of Ruse, 7017 Ruse, Bulgaria
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Department of Electrical Power Engineering, University of Ruse, 7017 Ruse, Bulgaria
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Department of Telecommunications, University of Telecommunications and Post, 1000 Sofia, Bulgaria
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Department of Physics, International Hellenic University, 65404 Kavala, Greece
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Author to whom correspondence should be addressed.
†
Presented at the International Conference on Electronics, Engineering Physics and Earth Science (EEPES’23), Kavala, Greece, 21–23 June 2023.
Eng. Proc. 2023, 41(1), 1; https://doi.org/10.3390/engproc2023041001
Published: 7 July 2023
(This article belongs to the Proceedings of International Conference on Electronics, Engineering Physics and Earth Science (EEPES'23))
The second edition of the International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2023) was held in hybrid form in Kavala, Greece, from 21 to 23 June 2023.
The EEPES 2023 conference is a premier international event focused on understanding the current state and evolution of science through the lens of engineering physics, electronics devices and microelectronics, telecommunications, optical and electromagnetic communication, artificial intelligence and soft computing, environmental physics and renewable energy, as well as many other disciplines. It is a place where researchers, academics, people in industry, students, and those alike present and discuss recent progress in research, development, standards, and applications related to applied and engineering physics.
The technical program of this year’s edition of the conference consisted of two distinguished keynotes by world-renowned experts; the titles of their plenary lectures are as follows:
- Prof. Dr. George A. Papakostas, International Hellenic University, Greece, “Computer Vision in the Industry Era”;
- Prof. Dr. Veneta Aleksieva, Technical University of Varna, Bulgaria, “Blockchain Based Solutions: Industry’s Dreams or Reality”.
Interesting plenary sessions were prepared not only by respected university professors and academia speakers on visionary topics but also by our sponsors, Raycap S.A., Greece and EN.PO.KA S.A., Kavala, Greece, who gave distinguished technical presentations.
The technical program of the conference consisted of one plenary session, one technical session, and seven in-person and nine online tracks for research papers. The authors of accepted papers who were unable to attend the conference in person were given the opportunity to present their papers online and attend an interactive virtual conference. Online presentations were held in a virtual room environment via the meeting platform Zoom for the opening ceremony, all conference sessions, and meetings.
Finally, we are thankful to the Municipality of Kavala, Greece, and Dimofeleia, Kavala, Greece, for becoming an official sponsor of the EEPES 2023 as well as all the abovementioned partners for their cooperation and technical and financial support. We express thanks to the institutional partners of the University of Ruse “Angel Kanchev” and the University of Telecommunications and Post, Sofia, both from Bulgaria and the International Hellenic University, Greece, TPC members, conference chairs, and reviewers for their wonderful efforts in making a successful and rigorous technical program. Without them, this event could not have happened.
A companion Special Issue of Electronics, hosted at https://www.mdpi.com/journal/electronics/special_issues/F67Z2SR1ES, and a Special Issue of Energies, hosted at https://www.mdpi.com/journal/energies/special_issues/OG9BD3054I, are both collecting full-length versions of selected papers.
We extend warm thanks to Mr. Eric Lin and Mr. Jimmy Huang for their extraordinary editorial work and support before, during, and after the EEPES 2023 conference.
Conflicts of Interest
The authors declare no conflict of interest.
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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
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MDPI and ACS Style
Iliev, T.; Stoyanov, I.; Mihaylov, G.; Fantidis, J. Preface of the International Conference on Electronics, Engineering Physics and Earth Science (EEPES’23). Eng. Proc. 2023, 41, 1. https://doi.org/10.3390/engproc2023041001
AMA Style
Iliev T, Stoyanov I, Mihaylov G, Fantidis J. Preface of the International Conference on Electronics, Engineering Physics and Earth Science (EEPES’23). Engineering Proceedings. 2023; 41(1):1. https://doi.org/10.3390/engproc2023041001
Chicago/Turabian StyleIliev, Teodor, Ivaylo Stoyanov, Grigor Mihaylov, and Jacob Fantidis. 2023. "Preface of the International Conference on Electronics, Engineering Physics and Earth Science (EEPES’23)" Engineering Proceedings 41, no. 1: 1. https://doi.org/10.3390/engproc2023041001
