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Journal: Eng. Proc., 2020
Volume: 2
Number: 30
30
Article: Wafer-Level Packaged CMOS-SOI-MEMS Thermal Sensor at Wide Pressure Range for IoT Applications
Authors: by Moshe Avraham, Gady Golan, Michele Vaiana, Giuseppe Bruno, Maria Eloisa Castagna, Sara Stolyarova, Tanya Blank and Yael Nemirovsky
Link: https://www.mdpi.com/2673-4591/2/1/30

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