Order Article Reprints
Journal: Eng. Proc., 2020
Volume: 2
Number: 30
Article:
Wafer-Level Packaged CMOS-SOI-MEMS Thermal Sensor at Wide Pressure Range for IoT Applications
Authors:
by
Moshe Avraham, Gady Golan, Michele Vaiana, Giuseppe Bruno, Maria Eloisa Castagna, Sara Stolyarova, Tanya Blank and Yael Nemirovsky
Link:
https://www.mdpi.com/2673-4591/2/1/30
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.