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Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices

Department of Materials and Chemical Engineering, Hanyang University, Hanyangdaehak-ro 55, Ansan-si 15588, Korea
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Electron. Mater. 2020, 1(1), 28-39; https://doi.org/10.3390/electronicmat1010004
Received: 20 August 2020 / Revised: 17 September 2020 / Accepted: 18 September 2020 / Published: 23 September 2020
(This article belongs to the Special Issue Feature Papers of Electronic Materials)
Inkjet-printed patterns were formed on a paper substrate using anti-oxidant copper nano-ink for application to disposable electronic devices. To prevent substrate damage, the pattern was flash light sintered under ambient conditions using the multi-pulse technique. Pure copper nanoparticles were coated with 1-octanethiol for oxidation resistance using the dry-coating method. Mixing these with 1-octanol solvent at a concentration of 30 wt% produced the copper nano-ink. Photo paper was used as the substrate. The contact angle between the photo paper and copper nano-ink was 37.2° and the optimal energy density for the multi-pulse flash light sintering technique was 15.6 J/cm2. Using this energy density, the optimal conditions were an on-time of 2 ms (duty cycle of 80%) for three pulses. The resistivity of the resulting pattern was 2.8 × 10−7 Ω∙m. After bending 500 times to a radius of curvature of 30 mm, the relative resistance (ΔR/R0) of the multi-pulse flash light-sintered pattern hardly changed compared to that of the unbent pattern, while the single-pulse-sintered pattern showed dramatic increase by 8-fold compared to the unbent pattern. Therefore, the multi-pulse light sintering technique is a promising approach to produce an inkjet-printed pattern that can be applied to disposable electronic devices. View Full-Text
Keywords: copper nanoparticles; anti-oxidation; inkjet printing; flash light sintering; 1-octanethiol copper nanoparticles; anti-oxidation; inkjet printing; flash light sintering; 1-octanethiol
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MDPI and ACS Style

Son, Y.; Shin, D.; Kang, M.; Lee, C.S. Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices. Electron. Mater. 2020, 1, 28-39. https://doi.org/10.3390/electronicmat1010004

AMA Style

Son Y, Shin D, Kang M, Lee CS. Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices. Electronic Materials. 2020; 1(1):28-39. https://doi.org/10.3390/electronicmat1010004

Chicago/Turabian Style

Son, Yeonho, Dongho Shin, Minkyu Kang, and Caroline S. Lee 2020. "Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices" Electronic Materials 1, no. 1: 28-39. https://doi.org/10.3390/electronicmat1010004

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