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Review

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

1
College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing 100029, China
2
State Key Laboratory of Organic-Inorganic Composites, Beijing University of Chemical Technology, Beijing 100029, China
*
Authors to whom correspondence should be addressed.
These authors contribute equally.
J. Compos. Sci. 2020, 4(4), 180; https://doi.org/10.3390/jcs4040180
Received: 24 October 2020 / Revised: 23 November 2020 / Accepted: 24 November 2020 / Published: 29 November 2020
(This article belongs to the Special Issue Polymer Composites: Fabrication and Applications)
At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs. View Full-Text
Keywords: thermal conductivity; polymer composites; conductive network; thermal management thermal conductivity; polymer composites; conductive network; thermal management
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MDPI and ACS Style

Zhang, H.; Zhang, X.; Fang, Z.; Huang, Y.; Xu, H.; Liu, Y.; Wu, D.; Zhuang, J.; Sun, J. Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review. J. Compos. Sci. 2020, 4, 180. https://doi.org/10.3390/jcs4040180

AMA Style

Zhang H, Zhang X, Fang Z, Huang Y, Xu H, Liu Y, Wu D, Zhuang J, Sun J. Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review. Journal of Composites Science. 2020; 4(4):180. https://doi.org/10.3390/jcs4040180

Chicago/Turabian Style

Zhang, Hao, Xiaowen Zhang, Zhou Fang, Yao Huang, Hong Xu, Ying Liu, Daming Wu, Jian Zhuang, and Jingyao Sun. 2020. "Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review" Journal of Composites Science 4, no. 4: 180. https://doi.org/10.3390/jcs4040180

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