On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials and Preparation
2.2. Joining Procedure
2.3. Microstructural Analyses
3. Results
3.1. Bonding Temperature
3.2. Microstructure of Base Material and the Bonding Zone
- (1)
- Athermally Solidified Zone (ASZ), which solidified by decreasing temperature from bonding temperature to room temperature.
- (2)
- Isothermally Solidified Zone (ISZ), which solidified at the constant temperature (bonding temperature) and segregation of reinforcement particles was obvious in this zone.
- (3)
- Base Material (BM), which did not have an effect on this zone with increasing temperature.
4. Discussion
4.1. Athermally Solidification Zone (ASZ)
4.2. Isothermal Solidification Zone (ISZ)
- (1)
- Isothermal solidified α-Al
- (2)
- Primary α-Al precipitated from the liquid (Cαl), solidifying from the bonding temperature to eutectic temperature
- (3)
- Eutectic (CuAl2+α) phase, which solidified from the liquid under the eutectic temperature
4.3. Width of ASZ
4.4. Shear Strength of Samples
5. Conclusions
- (1)
- Three zones were identified in the bonding interface:
- (i)
- An athermally solidified zone, which was in the center of the bonding line; it had porosities due to the use of Cu power
- (ii)
- An isothermally solidified zone, which can be characterized by the segregation of reinforcement particles
- (iii)
- Base metal, which did not have an effect on the microstructure even with increasing temperature
- (2)
- By increasing bonding time due to the diffusion of copper from the interlayer to the base metal, the width of ASZ decreased. In addition, by decreasing the amount of liquid formed at the bonding temperature, the reinforcement particles engulfed in the liquid decreased. Therefore, the width of the segregated zone (ISZ) decreased.
- (3)
- By increasing bonding time and diffusion of Cu from the interlayer, the amount of intermetallic phase (CuAl2) decreased in ISZ.
- (4)
- The maximum shear strength, 60 MPa (75% shear strength of as received composite), was obtained from the Cu-5 sample. Decrease in the amount of CuAl2, the width of ASZ, and homogenizing of the bonding zone due to the diffusion of copper were considered as the reasons for increasing shear strength by increasing bonding time.
Author Contributions
Funding
Conflicts of Interest
References
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Element | Al | Si | Mg | Fe | Cu | Mn | Cr | Ni | Zn | Ti |
---|---|---|---|---|---|---|---|---|---|---|
wt.% | Bal | 5.5 | 9.7 | 0.09 | 0.001 | 0.02 | 0.003 | 0.007 | 0.007 | 0.009 |
Element | Cu | P | Ag | As | Fe | Mn | Pb | Sb | Sn |
---|---|---|---|---|---|---|---|---|---|
wt.% | Bal | ≤0.001% | ≤0.002% | ≤0.0005% | ≤0.005% | ≤0.001% | ≤0.01% | ≤0.001% | ≤0.01% |
Bonding Time | 30 min | 1 h | 2 h | 5 h |
---|---|---|---|---|
Width of ASZ (μm) | 128 ± 15 | 119 ± 9 | 98 ± 11 | 56 ± 8 |
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Ghayoor, M.; Hadian, A.M. On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite. J. Compos. Sci. 2019, 3, 66. https://doi.org/10.3390/jcs3030066
Ghayoor M, Hadian AM. On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite. Journal of Composites Science. 2019; 3(3):66. https://doi.org/10.3390/jcs3030066
Chicago/Turabian StyleGhayoor, Milad, and Ali M. Hadian. 2019. "On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite" Journal of Composites Science 3, no. 3: 66. https://doi.org/10.3390/jcs3030066