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On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite

1
Department of Mechanical, Industrial and Manufacturing Engineering, Oregon State University, Corvallis, OR 97330, USA
2
School of Metallurgy and Materials Engineering, University of Tehran, Tehran 11554563, Iran
*
Author to whom correspondence should be addressed.
J. Compos. Sci. 2019, 3(3), 66; https://doi.org/10.3390/jcs3030066
Received: 21 May 2019 / Revised: 18 June 2019 / Accepted: 28 June 2019 / Published: 1 July 2019
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Abstract

Transient liquid phase diffusion bonding of an aluminum metal matrix composite with 15 wt.% Mg2Si reinforcement particles using Cu powder interlayer at 560 °C for different bonding times has been studied. Three different zones were identified at the bonding line: athermally solidified zone, isothermally solidified zone and base metal. By increasing the bonding time, due to the diffusion of copper to the substrate, the width of the athermally solidified zone decreased, became more homogenous and the amount of intermetallic phase (CuAl2) decreased. Therefore, the shear strength increased to a maximum of 60 MPa for the samples with a holding time of 5 h at the bonding temperature. View Full-Text
Keywords: Al metal matrix composite; transient liquid phase bonding; microstructure; joining Al metal matrix composite; transient liquid phase bonding; microstructure; joining
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Ghayoor, M.; Hadian, A.M. On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite. J. Compos. Sci. 2019, 3, 66.

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J. Compos. Sci. EISSN 2504-477X Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
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