Grigoriev, S.N.; Okunkova, A.A.; Volosova, M.A.; Hamdy, K.; Metel, A.S.
Influence of Dressing Methods on Chipping Size During Si and SiC Die Singulation: A Review. J. Manuf. Mater. Process. 2025, 9, 405.
https://doi.org/10.3390/jmmp9120405
AMA Style
Grigoriev SN, Okunkova AA, Volosova MA, Hamdy K, Metel AS.
Influence of Dressing Methods on Chipping Size During Si and SiC Die Singulation: A Review. Journal of Manufacturing and Materials Processing. 2025; 9(12):405.
https://doi.org/10.3390/jmmp9120405
Chicago/Turabian Style
Grigoriev, Sergey N., Anna A. Okunkova, Marina A. Volosova, Khaled Hamdy, and Alexander S. Metel.
2025. "Influence of Dressing Methods on Chipping Size During Si and SiC Die Singulation: A Review" Journal of Manufacturing and Materials Processing 9, no. 12: 405.
https://doi.org/10.3390/jmmp9120405
APA Style
Grigoriev, S. N., Okunkova, A. A., Volosova, M. A., Hamdy, K., & Metel, A. S.
(2025). Influence of Dressing Methods on Chipping Size During Si and SiC Die Singulation: A Review. Journal of Manufacturing and Materials Processing, 9(12), 405.
https://doi.org/10.3390/jmmp9120405