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Journal: J. Manuf. Mater. Process., 2023
Volume: 7
Number: 137

Article: Manufacturing of High Conductivity, High Strength Pure Copper with Ultrafine Grain Structure
Authors: by Leila Ladani, Jafar Razmi and Terry C. Lowe
Link: https://www.mdpi.com/2504-4494/7/4/137

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