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Journal: J. Manuf. Mater. Process., 2022
Volume: 6
Number: 9
Article:
Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications
Authors:
by
Thomas Guenther, Kai Werum, Ernst Müller, Marius Wolf and André Zimmermann
Link:
https://www.mdpi.com/2504-4494/6/1/9
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