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Journal: J. Manuf. Mater. Process., 2020
Volume: 4
Number: 3
Article:
High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles
Authors:
by
Kavian O. Cooke, Anthony Richardson, Tahir I. Khan and Muhammad Ali Shar
Link:
https://www.mdpi.com/2504-4494/4/1/3
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