Development and Characterization of Stable Polymer Formulations for Manufacturing Magnetic Composites

Polymer bonded permanent magnets find significant applications in a multitude of electrical and electronic devices. In this study, magnetic particle-loaded epoxy resin formulations were developed for in-situ polymerization and material jetting based additive manufacturing processes. Fundamental material and process issues like particle settling at room temperature and elevated temperature curing, rheology control and geometric stability of the magnetic polymer during the thermal curing process are addressed. Control of particle settling, modifications in rheological behavior and geometric stability were accomplished using an additive that enabled the modification of the formulation behavior at different process conditions. The magnetic particle size and additive loading were found to influence the rheological properties significantly. The synergistic effect of the additive enabled the developing of composites with engineered magnetic filler loading. Morphological characterization using scanning electron microscopy revealed a homogenous particle distribution in composites. It was observed that the influence of temperature was profound on the coercive field and remanent magnetization of the magnetic composites. The characterization of magnetic polymers and composites using rheometry, scanning electron microscopy, X-ray diffraction and superconducting quantum interference device (SQUID) magnetometry analysis enabled the correlating of the behavior observed in different stages of the manufacturing processes. Furthermore, this fundamental research facilitates a pathway to construct robust materials and processes to develop magnetic composites with engineered properties. View Full-Text