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Load-Deflection Behavior of RF-MEMS Switches: FEA and Analytical Modeling for Prediction of Mechanical Properties

1
Institute for Microelectronics and Microsystems, CNR-IMM, 73100 Lecce, Italy
2
Fondazione Bruno Kessler, Center of Materials and Microsystems, 38132 Povo, Trento, Italy
3
Institute for Agricultural and Earthmoving Machines, CNR-IMAMOTER, 10135 Turin, Italy
*
Author to whom correspondence should be addressed.
Presented at the Eurosensors 2018 Conference, Graz, Austria, 9–12 September 2018.
Proceedings 2018, 2(13), 968; https://doi.org/10.3390/proceedings2130968
Published: 30 November 2018
(This article belongs to the Proceedings of EUROSENSORS 2018)
SixNy/a-Si/SixNy thin film RF-MEMS switches were fabricated by unconventional PECVD process using surface micromachining approach. The mechanical properties of tri-layer were measured by nanoindentation and wafer curvature method. Deflections of switches clamped on two opposite edges were measured by a profilometer applying increasing quasi-point pressure loads. Finite Element Analysis (FEA) was used to study the mechanical behavior of clamped-clamped switches. An analytical solution was developed and validated, numerically and experimentally, to describe the load-deflection response of perforated membranes to quasi-point loads. The proposed function was used to determine the internal stress of the investigated membranes; the relative error between the predicted and calculated stress values was in the range 2.1–8.5%.
Keywords: perforated clamped-clamped membrane; RF-MEMS switch; Finite Element Analysis; young’s modulus calculation; residual stress calculation perforated clamped-clamped membrane; RF-MEMS switch; Finite Element Analysis; young’s modulus calculation; residual stress calculation
MDPI and ACS Style

De Pascali, C.; Bagolini, A.; Duraccio, D.; Siciliano, P.; Francioso, L. Load-Deflection Behavior of RF-MEMS Switches: FEA and Analytical Modeling for Prediction of Mechanical Properties. Proceedings 2018, 2, 968.

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