Equivalent Circuit-Based Open-Circuit Sensitivity Modelling of a Capacitive-Type MEMS Acoustic Sensor on Wafer Level †
Abstract
:1. Introduction
2. Equivalent Circuit-Based Model
3. Results and Discussion
4. Conclusions
Author Contributions
Acknowledgments
References
- Scheeper, P.R.; Donk, A.G.H.; Olthuis, W.; Bergveld, P. A Review of Silicon Microphones. Sens. Actuators A Phys. 1994, 44, 1–11. [Google Scholar] [CrossRef]
- Torkkeli, A.; Rusanen, O.; Saarilahti, J.; Seppa, H.; Sipola, H.; Hietanen, J. Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate. Sens. Actuators A Phys. 2000, 85, 116–123. [Google Scholar] [CrossRef]
- Tilmans, H.A.C. Equivalent circuit representation of electromechanical transducers: I. Lumped-parameter systems. J. Micromech. Microeng. 1996, 9, 157–176. [Google Scholar] [CrossRef]
- Gato, M.; Iguchi, Y.; Ono, K.; Ando, A.; Takeshi, F.; Matsunaga, S.; Ya-suno, Y.; Tanioka, K.; Tajima, T. High-performance condenser microphone with single-crystalline silicon diaphragm and backplate. IEEE Sens. J. 2007, 7, 4–10. [Google Scholar] [CrossRef]
- Lee, J.; Jeon, J.H.; Je, C.H.; Kim, Y.-G.; Lee, S.Q.; Yang, W.S.; Lee, J.S.; Lee, S.-G. A concave-patterned TiN/PECVD-Si3N4/TiN diaphragm MEMS acoustic sensor based on a polyimide sacrificial layer. J. Micromech. Microeng. 2015, 25, 1–13. [Google Scholar] [CrossRef]
- Lee, J.; Jeon, J.H.; Kim, Y.-G.; Lee, S.Q.; Yang, W.S.; Lee, J.S.; Lee, S.-G. TiN/PECVD-Si3N4/TiN diaphragm-based capacitive-type MEMS acoustic sensor. Electron. Lett. 2016, 52, 468–470. [Google Scholar] [CrossRef]
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Lee, J.; Im, J.-P.; Kim, J.-H.; Lim, S.-Y.; Moon, S.-E. Equivalent Circuit-Based Open-Circuit Sensitivity Modelling of a Capacitive-Type MEMS Acoustic Sensor on Wafer Level. Proceedings 2018, 2, 725. https://doi.org/10.3390/proceedings2130725
Lee J, Im J-P, Kim J-H, Lim S-Y, Moon S-E. Equivalent Circuit-Based Open-Circuit Sensitivity Modelling of a Capacitive-Type MEMS Acoustic Sensor on Wafer Level. Proceedings. 2018; 2(13):725. https://doi.org/10.3390/proceedings2130725
Chicago/Turabian StyleLee, Jaewoo, Jong-Pil Im, Jeong-Hun Kim, Sol-Yee Lim, and Seung-Eon Moon. 2018. "Equivalent Circuit-Based Open-Circuit Sensitivity Modelling of a Capacitive-Type MEMS Acoustic Sensor on Wafer Level" Proceedings 2, no. 13: 725. https://doi.org/10.3390/proceedings2130725
APA StyleLee, J., Im, J. -P., Kim, J. -H., Lim, S. -Y., & Moon, S. -E. (2018). Equivalent Circuit-Based Open-Circuit Sensitivity Modelling of a Capacitive-Type MEMS Acoustic Sensor on Wafer Level. Proceedings, 2(13), 725. https://doi.org/10.3390/proceedings2130725