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Low-Offset In-Plane Sensitive Hall Arrangement

Institute of Robotics at Bulgarian Academy of Sciences, Sofia, Bulgaria
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Author to whom correspondence should be addressed.
Presented at the Eurosensors 2018 Conference, Graz, Austria, 9–12 September 2018.
Proceedings 2018, 2(13), 713; https://doi.org/10.3390/proceedings2130713
Published: 21 December 2018
(This article belongs to the Proceedings of EUROSENSORS 2018)
A novel in-plane sensitive Hall arrangement consisting of two identical n-Si three-contact (3C) elements and realized in a common technological process, is presented. In the solution, the minimization of the offset and its temperature drift is achieved by cross-coupling of the outer device contacts. This terminals’ connection provides equalizing currents between the two substrates which strongly compensate the inevitable difference in the electrical conditions in the two parts of the arrangement. As a result, the residual offset of both integrated Hall elements at the output Vout(0) and its temperature drift are strongly minimized. The residual offset is about 160 times smaller than the single-configuration one. The obtained output voltage-to-residual offset ratio at sensitivity of SRI ≈ 98 V/AT is very promising, reaching 6 × 103 at temperature T = 40 °C and induction 1 T. As a result, increased metrological accuracy for numerous applications is achieved. For a first time through the novel arrangement a suppression of sensitivity in the presence of external magnetic field could be achieved in order to obtain permanent offset information. This is one of the key results in the Hall device investigation.
Keywords: in-plane sensitive Hall arrangement; offset minimization; silicon three-contact Hall element in-plane sensitive Hall arrangement; offset minimization; silicon three-contact Hall element
MDPI and ACS Style

Lozanova, S.; Kolev, I.; Ivanov, A.; Roumenin, C. Low-Offset In-Plane Sensitive Hall Arrangement. Proceedings 2018, 2, 713. https://doi.org/10.3390/proceedings2130713

AMA Style

Lozanova S, Kolev I, Ivanov A, Roumenin C. Low-Offset In-Plane Sensitive Hall Arrangement. Proceedings. 2018; 2(13):713. https://doi.org/10.3390/proceedings2130713

Chicago/Turabian Style

Lozanova, Siya; Kolev, Ivan; Ivanov, Avgust; Roumenin, Chavdar. 2018. "Low-Offset In-Plane Sensitive Hall Arrangement" Proceedings 2, no. 13: 713. https://doi.org/10.3390/proceedings2130713

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