Jaegle, M.; Pernau, H.-F.; Pfützner, M.; Benkendorf, M.; Li, X.; Bartel, M.; Drost, S.; Wöllenstein, J.
On-Chip Temperature Compensation for Thermal Impedance Sensors. Proceedings 2018, 2, 1053.
https://doi.org/10.3390/proceedings2131053
AMA Style
Jaegle M, Pernau H-F, Pfützner M, Benkendorf M, Li X, Bartel M, Drost S, Wöllenstein J.
On-Chip Temperature Compensation for Thermal Impedance Sensors. Proceedings. 2018; 2(13):1053.
https://doi.org/10.3390/proceedings2131053
Chicago/Turabian Style
Jaegle, Martin, Hans-Fridtjof Pernau, Marcus Pfützner, Mike Benkendorf, Xinke Li, Markus Bartel, Susanne Drost, and Jürgen Wöllenstein.
2018. "On-Chip Temperature Compensation for Thermal Impedance Sensors" Proceedings 2, no. 13: 1053.
https://doi.org/10.3390/proceedings2131053
APA Style
Jaegle, M., Pernau, H.-F., Pfützner, M., Benkendorf, M., Li, X., Bartel, M., Drost, S., & Wöllenstein, J.
(2018). On-Chip Temperature Compensation for Thermal Impedance Sensors. Proceedings, 2(13), 1053.
https://doi.org/10.3390/proceedings2131053
