Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment †
Abstract
:1. Introduction
2. Design of the Microstrip Resonator
3. Characterization of the Sensor
Acknowledgments
Conflicts of Interest
References
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Philippe, J.; Arenas, C.; Henry, D.; Coustou, A.; Rumeau, A.; Aubert, H.; Pons, P. Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment. Proceedings 2017, 1, 629. https://doi.org/10.3390/proceedings1040629
Philippe J, Arenas C, Henry D, Coustou A, Rumeau A, Aubert H, Pons P. Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment. Proceedings. 2017; 1(4):629. https://doi.org/10.3390/proceedings1040629
Chicago/Turabian StylePhilippe, Julien, Cristina Arenas, Dominique Henry, Anthony Coustou, Alexandre Rumeau, Hervé Aubert, and Patrick Pons. 2017. "Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment" Proceedings 1, no. 4: 629. https://doi.org/10.3390/proceedings1040629
APA StylePhilippe, J., Arenas, C., Henry, D., Coustou, A., Rumeau, A., Aubert, H., & Pons, P. (2017). Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment. Proceedings, 1(4), 629. https://doi.org/10.3390/proceedings1040629