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Journal: Proceedings, 2017
Volume: 1
Number: 629
629
Article: Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment
Authors: by Julien Philippe, Cristina Arenas, Dominique Henry, Anthony Coustou, Alexandre Rumeau, Hervé Aubert and Patrick Pons
Link: https://www.mdpi.com/2504-3900/1/4/629

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