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Proceedings 2017, 1(4), 298;

Integration of Silica Aerogels in Microfluidic Chips

Institute of Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany
Microsystems Center Bremen (MCB), Bremen, Germany
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
Author to whom correspondence should be addressed.
Published: 9 August 2017
(This article belongs to the Proceedings of Eurosensors 2017)
PDF [593 KB, uploaded 1 September 2017]


This paper reports a method to integrate silica aerogels monolithically in microfluidic chips. Silica Aerogel is a highly porous bulk material. The gel was synthesized from tetraethyl orthosilicate by a sol-gel process. Polyethylene glycol and an extended aging period were used to strengthen the matrix minimizing gel shrinkage. This technique allows alcogel structures with high strength and stiffness that withstand high pressure during the subcritical drying process. Hexamethyldisilazane provides for hydrophobizing and prevents the formation of siloxane bonds during the drying process. The resulting transparent aerogels reach porosities of 85%, pore diameters around 50 nm and contact angles of 136°.
Keywords: silica aerogel; microchip; integration; sol-gel process; TEOS; porous materials; microfluidics silica aerogel; microchip; integration; sol-gel process; TEOS; porous materials; microfluidics
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Reede, S.; Bunge, F.; Vellekoop, M.J. Integration of Silica Aerogels in Microfluidic Chips. Proceedings 2017, 1, 298.

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