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Open AccessArticle

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

1
Institute for Micro Integration, University of Stuttgart, 70569 Stuttgart, Germany
2
Hahn-Schickard, 70569 Stuttgart, Germany
*
Author to whom correspondence should be addressed.
Instruments 2018, 2(4), 28; https://doi.org/10.3390/instruments2040028
Received: 7 November 2018 / Revised: 28 November 2018 / Accepted: 30 November 2018 / Published: 4 December 2018
Higher energy efficiency, more compact design, and longer lifetime of light-emitting diodes (LEDs) have resulted in increasing their market share in the lighting industry, especially in the industries of consumer electronics, automotive, and general lighting. Due to their robustness and reliability, LEDs have replaced conventional light sources, such as fluorescent lamps. Many studies are examining the reliability of LEDs as such or investigating their long-term behavior on standard printed circuit boards (PCB). However, the thermal performance of LEDs mounted on nonconventional substrates is still not explored enough. An interesting example for this is the molded interconnect devices (MID), which are well known for the great design freedom and the great potential for functional integration. These characteristics not only underline the main abilities of the MID technology, but also present some challenges concerning thermal management. The long-term behavior of LEDs on MID is still quite untapped and this prevents this technology from consolidating its existence. In this context, this work highlights a developed test setup aimed at investigating LEDs, mounted on molded interconnect devices, under combined stress conditions. The results of the reliability study, as well as the resulting lifetime model, are also illustrated and discussed. View Full-Text
Keywords: test setup; measurement approach; instrumentation; light measurement; temperature measurement; voltage measurement; light emitting diode; LED; optical devices; molded interconnect device; MID; PCB; reliability; thermal management; accelerated life test; lifetime model test setup; measurement approach; instrumentation; light measurement; temperature measurement; voltage measurement; light emitting diode; LED; optical devices; molded interconnect device; MID; PCB; reliability; thermal management; accelerated life test; lifetime model
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MDPI and ACS Style

Soltani, M.; Freyburger, M.; Kulkarni, R.; Mohr, R.; Groezinger, T.; Zimmermann, A. Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices. Instruments 2018, 2, 28.

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