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Strain-Engineered Thermal Transport at One- to Two-Dimensional Junctions in 3D Nanostructures
 
 
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C 2026, 12(1), 2; https://doi.org/10.3390/c12010002 (registering DOI)
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article supplementary file uploaded. 27 December 2025 13:11 CET - https://www.mdpi.com/2311-5629/12/1/2#supplementary
article pdf uploaded. 27 December 2025 13:11 CET Version of Record https://www.mdpi.com/2311-5629/12/1/2/pdf
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