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Journal: Gels, 2026
Volume: 12
Number: 822
Article:
Strain-Insensitive Conductive Hydrogel Materials for Motion-Artifact-Free Flexible Bioelectronics
Authors:
by
Yarong Ding, Yitong Dou, Lei Bai, Zhenyu Li, Jiayi Qi, Yufeng Li, Shaozhe Tan, Xuesi Zhang, Jiachun Sun, Yahui Song, Jingxuan Wu, Fei Han and Yingchun Li
Link:
https://www.mdpi.com/2310-2861/12/9/822
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