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CMOS-Compatible Measures for Thermal Management of Phase-Sensitive Silicon Photonic Systems

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Department of Microsystems and Nanotechnologies (CR/ARY), Corporate Sector Research and Advance Engineering, Robert Bosch GmbH, 71272 Renningen, Germany
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Institute for Micro Integration (IFM), University of Stuttgart, 70569 Stuttgart, Germany
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Hahn-Schickard, 70569 Stuttgart, Germany
*
Author to whom correspondence should be addressed.
Photonics 2020, 7(1), 6; https://doi.org/10.3390/photonics7010006
Received: 3 December 2019 / Revised: 17 December 2019 / Accepted: 24 December 2019 / Published: 1 January 2020
To date, several photonic applications have been demonstrated without considerable thermal management efforts. However, in phase-sensitive photonic applications, thermal management becomes of utmost importance. Thermal management of photonic systems requires not only efficient heat dissipation, but also reduction of on-chip temperature gradients. Particularly in highly integrated systems, in which several components are integrated within a single photonic integrated circuit, the reduction of on-chip temperature gradients is necessary to guarantee the correct functionality of the system. Due to their high integration density as well as their extreme temperature sensitivity, optical phased arrays are ideal examples of a system, where thermal management is required. Ideally, thermal management solutions of such systems should not require additional power for operation. Therefore, it is desired to improve the heat dissipation and to reduce temperature gradients by structural modifications of the photonic circuit. Furthermore, to cope with the advantages of silicon photonics, thermal management solutions must be compatible with series fabrication processes. In this work, complementary metal–oxide–semiconductor (CMOS)-compatible measures for thermal management of silicon photonic integrated circuits are proposed and validated by characterization of in-house fabricated thermal demonstrators. The proposed concepts are extremely efficient not only in reducing temperature gradients, but also in improving the heat dissipation from integrated heat sources. View Full-Text
Keywords: Photonic Integrated Circuits (PIC); silicon photonics; thermal management; optical beam steering; Optical Phased Arrays (OPAs); complementary metal–oxide–semiconductor (CMOS) fabrication Photonic Integrated Circuits (PIC); silicon photonics; thermal management; optical beam steering; Optical Phased Arrays (OPAs); complementary metal–oxide–semiconductor (CMOS) fabrication
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Krochin-Yepez, P.-A.; Scholz, U.; Zimmermann, A. CMOS-Compatible Measures for Thermal Management of Phase-Sensitive Silicon Photonic Systems. Photonics 2020, 7, 6.

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