Next Article in Journal
Research on Ecological Efficiency for the Remanufacturing Process Considering Optimization and Evaluation
Next Article in Special Issue
Intelligent Control Strategy for Transient Response of a Variable Geometry Turbocharger System Based on Deep Reinforcement Learning
Previous Article in Journal
Adsorption Process and Properties Analyses of a Pure Magadiite and a Modified Magadiite on Rhodamine-B from an Aqueous Solution
Previous Article in Special Issue
Study on Three-Dimensional Stress Field of Gob-Side Entry Retaining by Roof Cutting without Pillar under Near-Group Coal Seam Mining
 
 

Order Article Reprints

Journal: Processes, 2019
Volume: 7
Number: 566

Article: Grouping Method of Semiconductor Bonding Equipment Based on Clustering by Fast Search and Find of Density Peaks for Dynamic Matching According to Processing Tasks
Authors: by Zhijun Gao, Wen Si, Zhonghua Han, Jiayu Peng and Feng Qiao
Link: https://www.mdpi.com/2227-9717/7/9/566

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop