1. Introduction
Sulfur hexafluoride (SF
6) has been widely used in the power industry due to its excellent insulation and arc extinguishing properties. A total of 80% of the SF
6 is used in high voltage circuit breakers and other high-pressure gas insulation equipment [
1]. However, SF
6 was listed as one of the six major greenhouse gases with a GWP (Global Warming Potential) of 23,500 and an atmospheric lifetime of 3200 years in the 1972 Kyoto Protocol [
2,
3]. Although the atmospheric concentration of SF
6 is relatively low, contributing to 0.1% of the total anthropogenic radiative forcing, the concentration is growing continuously because of the compound’s long lifetime of ~3200 years [
4,
5]. Over the past five years, the content of SF
6 in the global atmosphere has increased by 20% [
6]. California proposed that the use of SF6 in the electrical field should be reduced annually from 2020 and the European Union plans to reduce SF
6 emissions to 2/3 between 2014 and 2030 [
7]. In order to ensure the sustainable development of the power industry, reducing the use of SF
6 has become an important task in the current production and use of power equipment. In addition, SF
6 could generate a variety of harmful gases such as SO
2, SOF
2, SO
2F
2, S
2F
10, under partial discharge, spark discharge or arc discharge [
8,
9,
10]. Therefore, looking for an environmentally friendly and safe gas as an alternative insulation medium in power equipment, has become a sought-after solution.
In the current research, the ideal substitutes for SF
6 include perfluorocarbons (PFCs), trifluoroiodomethane (CF
3I), and other gases. Among them, the C-I bond of CF
3I can easily be broken to produce iodine solid, which produces toxic gases such as CH
3I, COF
2 after discharge, which is not conductive to the long-term safe operation of the equipment [
11,
12]. Of course, the adsorbent can adsorb by-products, but finding a suitable adsorbent and whether the adsorbent has an effect on the insulation is also a problem. PFCs mainly include C
2F
6, C
3F
8, c-C
4F
8, among which c-C
4F
8 is the most excellent insulating property (about 1.18 times that of SF
6). It is non-toxic to humans and the environment with the GWP of 8700 and the liquefaction temperature of −6 °C [
13]. Although c-C
4F
8 also has greenhouse effect, its global warming potential is much lower than SF
6 (23,000). Replacement of SF
6 with c-C
4F
8 in power equipment will significantly reduce the greenhouse effect. So far, there are still many scholars to study the possibility of replacement SF
6.
Concerning the new environmentally friendly insulation gas produced by 3M, apart from the C
5F
10O (Novec 5110) mentioned by reviewers, there is also C
4F
7N (Novec 4710) [
14,
15]. Both of these gases are hot in the current stage of research. We do not deny the superior performance of these two gases. However, gas liquefaction temperatures such as C
5F
10O are too high to be suitable for all types of gas-insulated equipment. In recent years, many researchers have studied the insulation performance of c-C
4F
8 with N
2, CO
2 and other mixed gases under DC, AC and lightning impulse voltage. It is concluded that the electrical strength of c-C
4F
8-N
2 mixtures can only reach approximately 0.57 times that of pure SF
6 at 0.5 MPa with c-C
4F
8 concentrations of 20% [
16], but 15–20% c-C
4F
8 gas mixture meets the requirements of electrical equipment, and mixtures can greatly reduce the impact of insulating gas on the environment [
17,
18,
19]. Li et al. calculated the mixtures between c-C
4F
8 and variety of gases in order to determine the mixed gas insulation. For example, the critical breakdown strength of c-C
4F
8-N
2 and c-C
4F
8-air are similar and significantly higher than other mixed gases. When the content of c-C
4F
8 exceeds 80%, the insulation property of mixture can reach the level of pure SF
6 but there is a lack of experimental data for validation [
20]. Some studies on the decomposition characteristics of c-C
4F
8 have achieved some results. Li et al. [
21] explored the decomposition products of c-C
4F
8 under various typical faults based on the gas chromatograph-mass spectrometer test. It was found that the decomposition of c-C
4F
8 mainly produced CF
4, C
2F
6 and C
2F
4, C
3F
8, C
3F
6. Hayashi et al. [
22] discussed the main pathways for the dissociation of c-C
4F
8 to generate free radicals CF
2 based on the density functional theory (DFT), providing guidance for further investigation of the decomposition mechanism of c-C
4F
8. As the core insulating gas, c-C
4F
8 may need to be mixed with other gases due to the liquefaction temperature, and dry air is the common buffer gas. The theoretical calculations and experimental studies have shown that c-C
4F
8-N
2 has good insulation properties. Potential alternative environmentally-friendly alternative gas and dry air often are mixed as an insulating medium. Additionally, in order to promote the recovery after the arc, O
2 often appears in the arc medium. However, the related research is lacking, and the toxicity and environmental safety of the decomposition products after mixing with oxygen are urgent to be investigated. Oxygen introduction is divided into passive introduction and active introduction. Passive introduction mainly refers to the introduction of trace amounts of oxygen introduced by the equipment during operations such as transportation, assembly, maintenance, and ventilation. Generally, it will not exceed 1%, which is similar to the problems faced by SF
6 gas insulation equipment [
23]. The other is active introduction, because the environment-friendly insulation gas may be mixed with dry air to fill the equipment. In addition to nitrogen and CO
2, dry air mainly contains O
2. The safety of the other two gases has been verified in many studies [
24]. Therefore, the influence of O
2 on the insulation performance and decomposition properties of c-C
4F
8 also needs to be studied, and it is very urgent.
The influence of oxygen on the decomposition of mixed gas can provide the basis for exploring c-C4F8-air and the performance analysis of the decomposition products is also an important indicator of evaluation gas application. In order to obtain a new insulation formula for environmental safety and to study the possible causes of hazardous products, it is necessary to test and analyze the physical and chemical processes of oxygen gas mixture discharge.
In this paper, the decomposition products of pure c-C4F8 and the c-C4F8/N2 mixed gas are explored experimentally and the influence of oxygen are also considered. N2 is just the buffer gas added in order to reduce the liquefaction temperature, because its physical and chemical properties are stable and not easy to decompose. After several frequency breakdown experiments, the decomposition products and electrode precipitation elements were obtained by GC-MS (gas chromatography mass spectrometry) and XPS (X-ray photoelectron spectroscopy). Based on the density functional theory, the structural characteristics of c-C4F8 were calculated firstly, the stability of the molecular structure and the reactive sites were analyzed. The possible dissociation pathways of c-C4F8 and the formation mechanism of the decomposition products were discussed. The purpose of this paper is to study the changes of decomposition products with the participation of oxygen and explore the safety and environmental protection of products. The comprehensive evaluation of the influence of oxygen on the decomposition characteristics of c-C4F8 provides a reference for the research of SF6 alternative gas.
2. Experimental Setup
The test was carried out at a 50 Hz AC voltage gas insulation performance test platform. In the experiment, N2, which is stable chemically gas, was used as the buffer gas.
Before the experiment, the airtightness of the gas chamber was checked, and the sealed gas chamber was evacuated using a vacuum pump (BECKER/VT4.16, BECKER, Wuppertal, Germany) and was allowed to stand still for 60 min (less than 10 Pa). N2 gas is used to clean the gas chamber. The above steps are repeated 2 to 3 times in order to avoid the influence of impurity gases. After cleaning, the mixed gas is introduced into the gas chamber. The ball-ball electrode was used in the experiment. The diameter of the copper ball was 50 mm with the electrode spacing of 5 mm. The range of applications for mixed gases may be medium-voltage gas-insulated devices such as switch cabinets. Because the key part of the conductivity in these devices is made of copper, it is used as the electrode material. The purity level of the c-C4F8 and N2 is 99.999%.
According to the literature [
24], it has been shown that the breakdown behavior of c-C
4F
8/N
2 mixture (the mixing ratio of c-C
4F
8 is 5%~20%) under uniform electric field is similar to that of SF
6/N
2 with the same mixing ratio. The Corona discharge performance of c-C
4F
8/N
2 is better than the same mixing ratio SF
6/N
2. If the c-C
4F
8/N
2 gas mixture is not liquefied at −30 °C, the content of c-C
4F
8 in the gas mixture is at most about 15% [
25]. Therefore, the pure c-C
4F
8, 15% c-C
4F
8/N
2 and with 3% O
2 were selected as samples in this paper. The test was carried out by a step-and-step method, and the gas mixture was broken down 50 times to detect decomposition products. The details are shown in
Figure 1.
GC-MS is used for detection of gas mixture components after the breakdown discharge. CP Sil 5CB was selected as the column. GC analysis, the high purity He (the purity of gas is above 99.999%) gas is used as a carrier gas, and carrier gas filters (including He filter and RP oil filter) are used to filter out the impurities, which may affect the column and interfere with the experimental results. Inlet temperature is 220 °C and inlet pressure is 56.1 kPa. The injection mode uses a split flow method with a split ratio of 10:1 and an injection volume of 1 mL. The column flow rate is 1.2 mL/min, and the purge flow rate is 3.0 mL/min. The heating rate of gas into the oven is shown in
Figure 2. The oven had an initial temperature of 35 °C, a final temperature of 150 °C, and a temperature increase rate of 40 °C/min. The column temperature was maintained at 35 °C for 0~8 min, and after 8 min, the temperature rose steadily to 150 °C, and the temperature rising rate was kept at 40 °C/min. MS analysis, the ion source temperature is 200 °C, the chromatographic mass spectrometry interface temperature is 220 °C, ionization mode is Electronic ionization (EI). The solvent delay time was 0.1 min; the detector voltage threshold was 100 and the voltage was 0.1 kV. The specific steps can be found in [
26,
27,
28,
29,
30].
4. Discussion
In order to explore the discharge decomposition path of c-C
4F
8 and the effect of O
2 on its decomposition, a thermodynamic and kinetic combination method was used to analyze the orientation and mechanism of the reaction based on density functional theory (DFT). With regard to theoretical knowledge of calculations, it has been described in detail in our previous work [
30,
31]. The Dmol3 package was used to process exchange-related interactions using a local density approximation (LDA-PWC) approach to optimize the structure of c-C
4F
8 and O
2 [
25]. To model the possible reaction path, the stable molecular configuration with the lowest energy is needed for selection. By calculating the energy of reactants and products, we can get the energy change before and after the reaction, and judge the difficulty of the reaction from the thermodynamic point of view. In addition, the constructed non-decomposing reaction path needs to be searched for transition state [
32]. Because during the process of chemical bond breaking and rearrangement, the intermediate activated complexes will be absorbed by the reactants to produce a certain amount of energy, and the process of generating activated complexes often determines the reaction rate. Therefore, the transition state structure and the corresponding activation energy are helpful to evaluate the reaction from the kinetic point of view. Finally, combined with the test results, the dynamic equilibrium process of particles during the decomposition of c-C
4F
8 with O
2 was analyzed.
4.1. The Basic Properties of c-C4F8
Figure 6 shows the geometry of optimized c-C
4F
8 molecule structure, where the bond length is Å and the bond angle is °. The c-C
4F
8 molecule has a high degree of symmetry. The C-C bond length is 1.583 Å and the C-F bond length is 1.350 Å. The F-C-F bond angle is 110.150° and the F-C-C bond angle is 113.587°.
The bond level is a physical quantity that describes the bond strength between adjacent atoms in the molecule, indicating the relative strength of the bond. In the collision of electrons and other particles or under high temperature conditions, the chemical bond may be broken, wherein the strength of the chemical bond relative to the strength of the smaller chemical bonds more difficult to break.
Figure 7 shows the calculated chemical bond levels for the c-C
4F
8 and SF
6 molecules. According to the calculation results, the C-C bond in the c-C
4F
8 molecule has a bond level value of 0.924 and the C-F bond with a value of 0.896. The intensity of the C-F bond in the c-C
4F
8 molecule is weaker than that of the C-C bond. Therefore, the C-F bond is more likely to dissociate than the C-C bond. In the SF
6 molecule, the S-F bond level value of the four co-planar F atoms and the S atom is 0.826, and the other the S-F bond level value is 0.829. Overall, the bond level of the chemical bonds in the SF
6 molecule is smaller than the bond order of the chemical bonds in the c-C
4F
8 molecule, indicating that the stability of the molecular structure of the SF
6 is inferior to that of the c-C
4F
8 molecule, which explains the c-C
4F
8 gas dielectric strength is superior to SF
6 gas.
The distribution of the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) of c-C
4F
8 is calculated from the orbital distribution of the molecules, as shown in
Figure 8. The corresponding energies are −0.298645 Ha and −0.086768 Ha, respectively. The energy difference between LUMO and HOMO characterizes the stability of the gas involved in the chemical reaction. The larger the difference is, the larger the energy required for the electron transition in the molecule is and the more stable the molecule is.
4.2. The Decomposition Path of c-C4F8 and the Main Product Generation Mechanism
Electrons are the main factors that cause collision ionization and dissociation in the electric field. Under the high-energy electric field or local overheating, the chemical bonds in the molecular structure of c-C
4F
8 will be cleaved, generating various types of free radicals, thereby damaging the insulation structure. In combination with the molecular structure of c-C
4F
8,
Table 3 shows the major pathways for the decomposition during the discharge process.
The decomposition pathway (1) refers to the process of two C-C bonds that located at the relative positions of the c-C4F8 molecule being disconnected to form free radicals. The pathway (2) refers to the disconnecting process of C-C bonds which are adjacent in the C-C4F8 molecule. The absorption energy required for pathway (1) is 173.8539 kJ/mol, which is lower than the 342.3815 kJ/mol required for pathway (2). The pathway (3) refers to the process of c-C4F8 which cleaves the C-F bond to produce C4F7· and F· free radicals, and the process need to absorb energy of 434.8436 kJ/mol, higher than pathway (1) and pathway (2).
Figure 9 shows the change trend of reaction energy of three decomposition paths (in
Table 3) with temperature. As the temperature increases, the energy required for molecular decomposition decreases gradually, and the increase of temperature is in favor of the reaction. The effect of temperature is considered mainly because the temperature changes during the discharge. In particular, there will be a significant increase in the temperature at the moment of breakdown, and the temperature at the center of the breakdown arc may reach 1000 k.
All kinds of free radicals generated by ionization or dissociation of c-C
4F
8 molecules can produce a series of new products by secondary reactions, mainly CF
4, C
2F
6, C
3F
8, C
2F
4 and C
3F
6.
Figure 10 shows the molecular model of the above decomposition product after optimization, and the bond length bond angle parameter is basically the same as that given in [
30].
Table 4 shows the chemical equations of decomposition products, energy changes and activation energy. Among them, the processes of free radical recombination are exothermic reactions to generate CF
4, C
3F
8, C
2F
4, C
3F
6 and C
2F
6. From a thermodynamic point of view, CF
4, C
2F
6, C
2F
4 are relatively easy to form, and C
3F
8 generation is more difficult.
According to the kinetic analysis, the path B1 to B5 reaction without energy barrier, are the processes of free radical complex into molecules, without activation spontaneously. The formation process of C
2F
6 release more energy, and the reaction is more prone to occur. The path B2 needs to release 83.7318 kJ/mol, which is the most difficult to occur with the least energy.
Figure 11 shows the energy changes of reactions with temperature. With the increase of temperature, the absolute value of the reaction enthalpy showed a different degree of decline. That is, the temperature is conducive to the reaction.
Path B6 reaction requires the formation of an activated complex transition state (TS). The reactant absorbs energy of 80.97188 kJ/mol, and then the activated complex TS releases energy to form the final product. The progress of the reaction is shown in
Figure 12. Small molecule product formation process releases more energy, so it can be concluded that free radicals such as F·, CF
2:, CF
3· generated by the decomposition of c-C
4F
8 molecules tend to recombine into small molecules, resulting in a large content of small molecule products, which is in good agreement with the previous experimental results.
In order to study the effect of O
2 on the decomposition of c-C
4F
8, the discharge decomposition path of O
2 must be studied first. In [
20], the main pathways for generating O· are given by O
2→2O· and O
2 + e→O· + O. It is also pointed out that the free radicals CF
2: and C
2F
4 are oxidized to COF
2 under O
2 conditions.
Figure 12 shows the geometrically optimized COF
2 molecular structure model.
Table 5 shows the reaction equations and energy changes for the free radical binding to COF
2 produced by c-C
4F
8 [
20]. The reaction is an exothermic reaction. O
2 can oxidize CF
2: to form COF
2 and O· oxidize C
2F
4: to generate COF
2 and CF
2:. The structure of COF
2 is shown in
Figure 13.
4.3. The Basic Properties of the Main Products
According to the experimental measurement and calculation results, it can be seen that the main decomposition products are CF
4, C
2F
4, C
2F
6, C
3F
6 and C
3F
8, and COF
2 is produced when O
2 is involved.
Figure 14 shows the molecular orbital energies of the main product. Based on the molecular orbital gap value, the main decomposition products have good stability. The C
2F
4, C
3F
6 and COF
2 containing double bonds are poorly stable in the chemical reaction.
At the same time, the relative insulation properties of the decomposition products were compared. The environmental values and ecological toxicity are shown in
Table 6.
The insulation strength of CF4 gas is about 39% of that of SF6 and the insulation performance of C2F6 is about 76% of that of SF6. The insulation performance of C3F8 is close to that of SF6, and the C4F10 has better insulation performance than SF6. The resulting decomposition products basically maintain the original mixed gas insulation properties. The GWP of all the products are lower than that of SF6, and the concentration of the product is very small, so the product could be considered as not harmful to the environment. However, when oxygen is involved in the mixed gas discharge process, COF2 will be generated, which is toxic and corrosive and harmful to the insulation equipment and operators. Therefore, oxygen content should be strictly controlled in the equipment.