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Journal: Processes, 2025
Volume: 13
Number: 1042
1042
Article: High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere
Authors: by Bofu Li, Yinyin Luo, Dejian Li, Dameng Li, Baobin Yang, Baoliang Gong, Shunfeng Han, Siliang He and Miao Cai
Link: https://www.mdpi.com/2227-9717/13/4/1042

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