Jiang, Y.; Zhao, M.; Zhao, L.; Chen, Q.; Huang, Q.; Song, X.; Zhang, C.; Wang, J.
Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components. Processes 2023, 11, 2052.
https://doi.org/10.3390/pr11072052
AMA Style
Jiang Y, Zhao M, Zhao L, Chen Q, Huang Q, Song X, Zhang C, Wang J.
Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components. Processes. 2023; 11(7):2052.
https://doi.org/10.3390/pr11072052
Chicago/Turabian Style
Jiang, Yuxuan, Min Zhao, Litao Zhao, Qin Chen, Qing Huang, Xiaolong Song, Chenglong Zhang, and Jingwei Wang.
2023. "Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components" Processes 11, no. 7: 2052.
https://doi.org/10.3390/pr11072052
APA Style
Jiang, Y., Zhao, M., Zhao, L., Chen, Q., Huang, Q., Song, X., Zhang, C., & Wang, J.
(2023). Research on the Disassembly Process and Model of Waste Mobile Phone Circuit Board Components. Processes, 11(7), 2052.
https://doi.org/10.3390/pr11072052