Jiang, G.; Chen, W.; Chen, J.; Yang, W.
Experimental Investigation of Thermal Contact Resistance at Flat/Curved Surface Interfaces Under Various Temperature, Pressure, and Surface Roughness Levels. Technologies 2026, 14, 41.
https://doi.org/10.3390/technologies14010041
AMA Style
Jiang G, Chen W, Chen J, Yang W.
Experimental Investigation of Thermal Contact Resistance at Flat/Curved Surface Interfaces Under Various Temperature, Pressure, and Surface Roughness Levels. Technologies. 2026; 14(1):41.
https://doi.org/10.3390/technologies14010041
Chicago/Turabian Style
Jiang, Guoqing, Wanhua Chen, Jianye Chen, and Wenguo Yang.
2026. "Experimental Investigation of Thermal Contact Resistance at Flat/Curved Surface Interfaces Under Various Temperature, Pressure, and Surface Roughness Levels" Technologies 14, no. 1: 41.
https://doi.org/10.3390/technologies14010041
APA Style
Jiang, G., Chen, W., Chen, J., & Yang, W.
(2026). Experimental Investigation of Thermal Contact Resistance at Flat/Curved Surface Interfaces Under Various Temperature, Pressure, and Surface Roughness Levels. Technologies, 14(1), 41.
https://doi.org/10.3390/technologies14010041