Kim, J.h.; Chun, M.Y.-S.; Nhung, D.T.H.; Lee, J.
The Transition of Samsung Electronics through Its M&A with Harman International. J. Open Innov. Technol. Mark. Complex. 2019, 5, 51.
https://doi.org/10.3390/joitmc5030051
AMA Style
Kim Jh, Chun MY-S, Nhung DTH, Lee J.
The Transition of Samsung Electronics through Its M&A with Harman International. Journal of Open Innovation: Technology, Market, and Complexity. 2019; 5(3):51.
https://doi.org/10.3390/joitmc5030051
Chicago/Turabian Style
Kim, Jung hyun, Monica Young-Shin Chun, Duong Thi Hong Nhung, and Jeonghwan Lee.
2019. "The Transition of Samsung Electronics through Its M&A with Harman International" Journal of Open Innovation: Technology, Market, and Complexity 5, no. 3: 51.
https://doi.org/10.3390/joitmc5030051
APA Style
Kim, J. h., Chun, M. Y.-S., Nhung, D. T. H., & Lee, J.
(2019). The Transition of Samsung Electronics through Its M&A with Harman International. Journal of Open Innovation: Technology, Market, and Complexity, 5(3), 51.
https://doi.org/10.3390/joitmc5030051