Palavesam, N.;                     Hell, W.;                     Drost, A.;                     Landesberger, C.;                     Kutter, C.;                     Bock, K.    
        Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics. Electronics 2020, 9, 238.
    https://doi.org/10.3390/electronics9020238
    AMA Style
    
                                Palavesam N,                                 Hell W,                                 Drost A,                                 Landesberger C,                                 Kutter C,                                 Bock K.        
                Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics. Electronics. 2020; 9(2):238.
        https://doi.org/10.3390/electronics9020238
    
    Chicago/Turabian Style
    
                                Palavesam, Nagarajan,                                 Waltraud Hell,                                 Andreas Drost,                                 Christof Landesberger,                                 Christoph Kutter,                                 and Karlheinz Bock.        
                2020. "Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics" Electronics 9, no. 2: 238.
        https://doi.org/10.3390/electronics9020238
    
    APA Style
    
                                Palavesam, N.,                                 Hell, W.,                                 Drost, A.,                                 Landesberger, C.,                                 Kutter, C.,                                 & Bock, K.        
        
        (2020). Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics. Electronics, 9(2), 238.
        https://doi.org/10.3390/electronics9020238