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Journal: Electronics, 2020
Volume: 9
Number: 1559

Article: Multi-Chip IGBT Module Failure Monitoring Based on Module Transconductance with Temperature Calibration
Authors: by Chenyuan Wang, Yigang He, Chuankun Wang, Lie Li and Xiaoxin Wu
Link: https://www.mdpi.com/2079-9292/9/10/1559

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