Order Article Reprints
Journal: Electronics, 2020
Volume: 9
Number: 1559
Article:
Multi-Chip IGBT Module Failure Monitoring Based on Module Transconductance with Temperature Calibration
Authors:
by
Chenyuan Wang, Yigang He, Chuankun Wang, Lie Li and Xiaoxin Wu
Link:
https://www.mdpi.com/2079-9292/9/10/1559
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.