Yang, C.; Tao, J.; Tang, W.; Dai, F.; Ji, Y.; Chen, W.; Wang, C.
Investigation of Reliability Strengthening by Six-Sided Protective Structure in Fan-Out Wafer-Level Packaging. Electronics 2025, 14, 4429.
https://doi.org/10.3390/electronics14224429
AMA Style
Yang C, Tao J, Tang W, Dai F, Ji Y, Chen W, Wang C.
Investigation of Reliability Strengthening by Six-Sided Protective Structure in Fan-Out Wafer-Level Packaging. Electronics. 2025; 14(22):4429.
https://doi.org/10.3390/electronics14224429
Chicago/Turabian Style
Yang, Cheng, Junyu Tao, Wenxue Tang, Feihu Dai, Yong Ji, Weijin Chen, and Chengqian Wang.
2025. "Investigation of Reliability Strengthening by Six-Sided Protective Structure in Fan-Out Wafer-Level Packaging" Electronics 14, no. 22: 4429.
https://doi.org/10.3390/electronics14224429
APA Style
Yang, C., Tao, J., Tang, W., Dai, F., Ji, Y., Chen, W., & Wang, C.
(2025). Investigation of Reliability Strengthening by Six-Sided Protective Structure in Fan-Out Wafer-Level Packaging. Electronics, 14(22), 4429.
https://doi.org/10.3390/electronics14224429
