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Journal: Electronics, 2025
Volume: 14
Number: 322

Article: Multilayer Printed Circuit Board Design Based on Copper Paste Sintering Technology for Satellite Communication Receiving Phased Array
Authors: by Sicheng Sun, Yijiu Zhao, Sitao Mei, Naixin Zhou and Yongling Ban
Link: https://www.mdpi.com/2079-9292/14/2/322

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