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Journal: Electronics, 2025
Volume: 14
Number: 292

Article: Comparison of the Reliability of SAC305 and Innolot-Based Solder Alloy in a Board-Level BGA Package Considering Harmonic and Random Vibration Environment
Authors: by Sima Besharat Ferdowsi, Sushil Doranga and Yueqing Li
Link: https://www.mdpi.com/2079-9292/14/2/292

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