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Journal: Electronics, 2024
Volume: 13
Number: 4573

Article: Accelerating Die Bond Quality Detection Using Lightweight Architecture DSGβSI-Yolov7-Tiny
Authors: by Bao Rong Chang, Hsiu-Fen Tsai and Wei-Shun Chang
Link: https://www.mdpi.com/2079-9292/13/22/4573

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