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Journal: Electronics, 2024
Volume: 13
Number: 4287

Article: A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices
Authors: by Yuqian Tu, Bin Liu, Guanghong Yao, Hongjie Luo, Xiao Jia, Jun Du and Cui Xu
Link: https://www.mdpi.com/2079-9292/13/21/4287

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