Tu, Y.; Liu, B.; Yao, G.; Luo, H.; Jia, X.; Du, J.; Xu, C.
A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices. Electronics 2024, 13, 4287.
https://doi.org/10.3390/electronics13214287
AMA Style
Tu Y, Liu B, Yao G, Luo H, Jia X, Du J, Xu C.
A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices. Electronics. 2024; 13(21):4287.
https://doi.org/10.3390/electronics13214287
Chicago/Turabian Style
Tu, Yuqian, Bin Liu, Guanghong Yao, Hongjie Luo, Xiao Jia, Jun Du, and Cui Xu.
2024. "A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices" Electronics 13, no. 21: 4287.
https://doi.org/10.3390/electronics13214287
APA Style
Tu, Y., Liu, B., Yao, G., Luo, H., Jia, X., Du, J., & Xu, C.
(2024). A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices. Electronics, 13(21), 4287.
https://doi.org/10.3390/electronics13214287