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        Journal: Electronics, 2024
        Volume: 13 
                	Number: 1802 
                
        
        Article:
        Ensemble Meta-Learning-Based Robust Chipping Prediction for Wafer Dicing 
        Authors: 
       	by
                    Bao Rong Chang, Hsiu-Fen Tsai and Hsiang-Yu Mo        
        Link:
        https://www.mdpi.com/2079-9292/13/10/1802
        
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