Order Article Reprints

Deng L, Li T, Wang Z, Zhang P, Wu S, Liu J, Zhang J, Chen L, Zhang J, Huang W, et al. Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages. Electronics. 2024; 13(1):203. https://doi.org/10.3390/electronics13010203

Deng, Liting, Te Li, Zhenfu Wang, Pu Zhang, Shunhua Wu, Jiachen Liu, Junyue Zhang, Lang Chen, Jiachen Zhang, Weizhou Huang, and et al. 2024. "Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages" Electronics 13, no. 1: 203. https://doi.org/10.3390/electronics13010203

Deng, L., Li, T., Wang, Z., Zhang, P., Wu, S., Liu, J., Zhang, J., Chen, L., Zhang, J., Huang, W., & Zhang, R. (2024). Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages. Electronics, 13(1), 203. https://doi.org/10.3390/electronics13010203