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Journal: Electronics, 2023
Volume: 12
Number: 908
Article:
Novel BIST Solution to Test the TSV Interconnects in 3D Stacked IC’s
Authors:
by
Renold Sam Vethamuthu Edward Alaises and Sivanantham Sathasivam
Link:
https://www.mdpi.com/2079-9292/12/4/908
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