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Journal: Electronics, 2023
Volume: 12
Number: 4116
Article:
Influence of a PCB Layout Design on the Efficiency of Heat Dissipation and Mutual Thermal Couplings between Transistors
Authors:
by
Krzysztof Górecki and Krzysztof Posobkiewicz
Link:
https://www.mdpi.com/2079-9292/12/19/4116
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