Li, Z.;                     Wang, G.;                     Yin, J.;                     Xue, H.;                     Guo, J.;                     Wang, Y.;                     Huang, M.    
        Development and Performance Analysis of an Atomic Layer Thermopile Sensor for Composite Heat Flux Testing in an Explosive Environment. Electronics 2023, 12, 3582.
    https://doi.org/10.3390/electronics12173582
    AMA Style
    
                                Li Z,                                 Wang G,                                 Yin J,                                 Xue H,                                 Guo J,                                 Wang Y,                                 Huang M.        
                Development and Performance Analysis of an Atomic Layer Thermopile Sensor for Composite Heat Flux Testing in an Explosive Environment. Electronics. 2023; 12(17):3582.
        https://doi.org/10.3390/electronics12173582
    
    Chicago/Turabian Style
    
                                Li, Zhiling,                                 Gao Wang,                                 Jianping Yin,                                 Hongxin Xue,                                 Jinqin Guo,                                 Yong Wang,                                 and Manguo Huang.        
                2023. "Development and Performance Analysis of an Atomic Layer Thermopile Sensor for Composite Heat Flux Testing in an Explosive Environment" Electronics 12, no. 17: 3582.
        https://doi.org/10.3390/electronics12173582
    
    APA Style
    
                                Li, Z.,                                 Wang, G.,                                 Yin, J.,                                 Xue, H.,                                 Guo, J.,                                 Wang, Y.,                                 & Huang, M.        
        
        (2023). Development and Performance Analysis of an Atomic Layer Thermopile Sensor for Composite Heat Flux Testing in an Explosive Environment. Electronics, 12(17), 3582.
        https://doi.org/10.3390/electronics12173582