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        Journal: Electronics, 2023
        Volume: 12 
                	Number: 3247 
                
        
        Article:
        Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components 
        Authors: 
       	by
                    Patrick Rochala, Christian Hofmann, Martin Kroll, Sushant Panhale, Rezan Javed and Karla Hiller        
        Link:
        https://www.mdpi.com/2079-9292/12/15/3247
        
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