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Journal: Electronics, 2023
Volume: 12
Number: 3247
Article:
Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components
Authors:
by
Patrick Rochala, Christian Hofmann, Martin Kroll, Sushant Panhale, Rezan Javed and Karla Hiller
Link:
https://www.mdpi.com/2079-9292/12/15/3247
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