Rochala, P.; Hofmann, C.; Kroll, M.; Panhale, S.; Javed, R.; Hiller, K.
Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components. Electronics 2023, 12, 3247.
https://doi.org/10.3390/electronics12153247
AMA Style
Rochala P, Hofmann C, Kroll M, Panhale S, Javed R, Hiller K.
Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components. Electronics. 2023; 12(15):3247.
https://doi.org/10.3390/electronics12153247
Chicago/Turabian Style
Rochala, Patrick, Christian Hofmann, Martin Kroll, Sushant Panhale, Rezan Javed, and Karla Hiller.
2023. "Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components" Electronics 12, no. 15: 3247.
https://doi.org/10.3390/electronics12153247
APA Style
Rochala, P., Hofmann, C., Kroll, M., Panhale, S., Javed, R., & Hiller, K.
(2023). Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components. Electronics, 12(15), 3247.
https://doi.org/10.3390/electronics12153247