Awais, M.; Ullah Khan, F.; Zafar, M.; Mudassar, M.; Zaigham Zaheer, M.; Mehmood Cheema, K.; Kamran, M.; Jung, W.-S.
Towards Enabling Haptic Communications over 6G: Issues and Challenges. Electronics 2023, 12, 2955.
https://doi.org/10.3390/electronics12132955
AMA Style
Awais M, Ullah Khan F, Zafar M, Mudassar M, Zaigham Zaheer M, Mehmood Cheema K, Kamran M, Jung W-S.
Towards Enabling Haptic Communications over 6G: Issues and Challenges. Electronics. 2023; 12(13):2955.
https://doi.org/10.3390/electronics12132955
Chicago/Turabian Style
Awais, Muhammad, Fasih Ullah Khan, Muhammad Zafar, Muhammad Mudassar, Muhammad Zaigham Zaheer, Khalid Mehmood Cheema, Muhammad Kamran, and Woo-Sung Jung.
2023. "Towards Enabling Haptic Communications over 6G: Issues and Challenges" Electronics 12, no. 13: 2955.
https://doi.org/10.3390/electronics12132955
APA Style
Awais, M., Ullah Khan, F., Zafar, M., Mudassar, M., Zaigham Zaheer, M., Mehmood Cheema, K., Kamran, M., & Jung, W.-S.
(2023). Towards Enabling Haptic Communications over 6G: Issues and Challenges. Electronics, 12(13), 2955.
https://doi.org/10.3390/electronics12132955