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Journal: Electronics, 2023
Volume: 12
Number: 109
Article:
Terahertz Hybrid Topological Chip for 10-Gbps Full-Duplex Communications
Authors:
by
Haisu Li, Yu Zhang, Yajing Liu and Shaghik Atakaramians
Link:
https://www.mdpi.com/2079-9292/12/1/109
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