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Journal: Electronics, 2023
Volume: 12
Number: 109

Article: Terahertz Hybrid Topological Chip for 10-Gbps Full-Duplex Communications
Authors: by Haisu Li, Yu Zhang, Yajing Liu and Shaghik Atakaramians
Link: https://www.mdpi.com/2079-9292/12/1/109

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