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Journal: Electronics, 2022
Volume: 11
Number: 542

Article: Survey on Fatigue Life Prediction of BGA Solder Joints
Authors: by Baojun Qiu, Jingang Xiong, Han Wang, Shuai Zhou, Xiuding Yang, Zhengpei Lin, Maolin Liu and Nian Cai
Link: https://www.mdpi.com/2079-9292/11/4/542

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