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Journal: Electronics, 2022
Volume: 11
Number: 3764

Article: A Single-Event Burnout Hardened Super-Junction Trench SOI LDMOS with Additional Hole Leakage Paths
Authors: by Yue Wang, Lixin Wang, Yuanzhe Li, Mengyao Cui and Zhuoxuan Zheng
Link: https://www.mdpi.com/2079-9292/11/22/3764

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