Order Article Reprints
Journal: Electronics, 2022
Volume: 11
Number: 3764
Article:
A Single-Event Burnout Hardened Super-Junction Trench SOI LDMOS with Additional Hole Leakage Paths
Authors:
by
Yue Wang, Lixin Wang, Yuanzhe Li, Mengyao Cui and Zhuoxuan Zheng
Link:
https://www.mdpi.com/2079-9292/11/22/3764
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.