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Journal: Electronics, 2022
Volume: 11
Number: 3098

Article: A Novel Radiation-Hardened CCDM-TSPC Compared with Seven Well-Known RHBD Flip-Flops in 180 nm CMOS Process
Authors: by Shixin Wang, Lixin Wang, Yue Wang, Min Guo and Yuanzhe Li
Link: https://www.mdpi.com/2079-9292/11/19/3098

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